Home > Rogers PCB > RO3206 High Frequency PCB DK 6.15 – Rogers RO3206 RF Circuits for 5G, Automotive, and Wireless Applications
RO3206 High Frequency PCB DK 6.15 – Rogers RO3206 RF Circuits for 5G, Automotive, and Wireless Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Introduction

The Rogers RO3206 high-frequency PCB materials are engineered laminates containing ceramic fillers reinforced with woven fiberglass. These materials are designed to deliver outstanding electrical performance and mechanical stability while remaining competitively priced. An extension of the RO3000 series, the RO3206 offers enhanced mechanical stability.


With a dielectric constant of 6.15 and a low dissipation factor of 0.0027, the RO3206 materials provide an extended frequency range suitable for applications requiring high-frequency performance, exceeding 40 GHz.


The RO3206 laminates merge the benefits of non-woven PTFE laminates—such as surface smoothness for fine line etching tolerances—with the rigidity of woven-glass PTFE laminates. They can be easily fabricated into printed circuit boards using standard PTFE processing techniques.


Manufactured under an ISO 9002 certified quality system, RO3206 laminates ensure consistent quality and adherence to stringent manufacturing standards.



Key Features and Benefits

The RO3206 PCB offers several key features and benefits:

Woven Glass Reinforcement: Enhances rigidity, simplifying handling during fabrication and assembly.
Uniform Electrical and Mechanical Performance: Ideal for complex multi-layer high-frequency structures, ensuring consistent performance throughout the design.
Low Dielectric Loss: Minimizes signal loss and distortion, enabling excellent high-frequency performance.
Low In-Plane Expansion Coefficient: Matched to copper, compatible with epoxy multi-layer board hybrid designs for reliable surface-mounted assemblies.
Excellent Dimensional Stability: Maintains consistent dimensions during manufacturing, leading to high production yields.
Cost-Effective Pricing: Provides economical solutions for volume manufacturing, making it a cost-efficient choice for large-scale production.
Surface Smoothness: Features a smooth surface for finer line etching tolerances, allowing for precise circuit design and fabrication.


Our PCB Capability (RO3206)

PCB Capability (RO3206) 
PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3206
Dielectric constant: 6.15
Dissipation factor 0.0027
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 25mil (0.635mm), 50mil (1.27mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..


Typical Applications

RO3206 PCBs are widely used in various industries, including:


1.Automotive collision avoidance systems
2.Automotive global positioning satellite antennas
3.Base station infrastructure
4.Direct broadcast satellites
5.Datalink on cable systems
6.LMDS (Local Multipoint Distribution Service) and wireless broadband
7.Microstrip patch antennas for wireless communications
8.Remote meter readers
9.Power backplanes
10.Wireless telecommunications systems


Rogers RO3206 Data Sheet

Click to expand/collapse the table

Typical Values
Property RO3206 Direction Unit Condtion Test Method
Dielectric Constant, εr Process 6.15± 0.15 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εr Design                      6.6 Z - 8  GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan δ 0.0027 Z - 10 GHz 23°C IPC-TM-650 2.5.5.5
Thermal Coefficient of εr -212 Z ppm/°C 10 GHz 0-100°C IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X,Y mm/m COND A ASTM D257
Volume Resistivity 103 MΩ•cm COND A IPC 2.5.17.1
Surface Resistivity 103 COND A IPC 2.5.17.1
Tensile Modulus 462
462
MD
CMD
kpsi 23°C ASTM D638
Water Absorption <0.1 - % D24/23 IPC-TM-650
2.6.2.1
Specific Heat 0.85 J/g/K Calculated
Thermal Conductivity 0.67 - W/m/K 80°C ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C) 13
34
X,Y,
Z
ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500 °C TGA ASTM D3850
Color Tan
Density 2.7 gm/cm3
Copper Peel Strength 10.7 pli 1 oz. EDC After Solder Float IPC-TM-2.4.8
Flammability V-0 UL 94
Lead Free Process
Compatible
YES


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